Abstract:
Corn flour is potentially used as a raw material in the production of corn noodle.The technology has been developed, but the result showed that the corn noodle had high cooking loss, low eslasticity, and sticky. One of method to overcome by the above problem was by substituting the corn flour with physically modified Head Moisture Treated (HMT)corn flour in corn noodle formulation. This research was objected to show the effect of Heat Moisture Treated on profile gelatinization of corn flour.The results of the study showed gelatinization profile changes from type B to type C.